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Maskless Lithography System - Young

System Composition

A DMD-based maskless lithography system typically comprises several key components: a light source module, a beam homogenization module, a DMD module, a projection module, a motion stage module, and software. These modules work together with high efficiency and precision to enable rapid, maskless lithography of high-resolution patterns.

 

Workflow

The host computer transmits pattern data to the DMD module, which displays the corresponding pattern. Light reflected from the DMD—carrying the pattern information—passes through a series of optical elements and illuminates the substrate, thereby transferring the pattern. The coordinated operation of the high-precision motion stage ensures the accurate stitching of different exposure areas, ultimately enabling the dynamic exposure of large-scale, complex patterns.

 

Key Features

  1. Flexible, maskless design
  2. Processing precision up to 400 nm
  3. Processing speed up to 1200 mm²/min
  4. Processing area up to 4 m²
  5. Grayscale lithography up to 4096 levels

 

 

Applications:

 

2D Materials 
Proprietary "guide light" and "direct writing" functions enable the direct patterning of electrodes onto target 2D materials with flexibility and high efficiency.

Applications of Maskless Lithography System 1

 

Microfluidics 
Maskless lithography systems can fabricate high-aspect-ratio (10:1) structures, offering high precision and flexibility for microfluidic chip manufacturing; they are widely used in fields such as single-cell analysis and sensor development.

Applications of Maskless Lithography System 2

 

MEMS 
Maskless lithography is widely applied in MEMS, enabling the high-precision fabrication of micron-scale patterns and the processing of complex structures through multi-layer alignment.

Applications of Maskless Lithography System 3

 

Microlenses 
Grayscale lithography allows for precise control over surface topography, enabling the creation of complex diffractive structures such as gratings, Fresnel lenses, and microlenses.

Applications of Maskless Lithography System 4

 

Optical Diffractive Devices 
In optical modulation devices, grayscale lithography utilizes precise control of exposure intensity to fabricate highly detailed optical microstructures, optimizing light wave modulation and transmission characteristics.

Applications of Maskless Lithography System 5

 

Relief Structures 
For anti-counterfeiting relief structures, grayscale lithography employs fine control of exposure intensity to create high-precision 3D microstructures, increasing the complexity and difficulty of replicating the anti-counterfeiting marks.

Applications of Maskless Lithography System 6

 

Metasurfaces 
Lithography processes enable the precise fabrication of micro- and nano-scale structures for metasurfaces, allowing for the fine manipulation of light waves and the modulation of optical properties such as specific wavelengths and polarization.

Applications of Maskless Lithography System 7

 

Quantum Optics 
In the field of quantum optical waveguides, lithography processes enable the precise etching of micro- and nano-scale waveguide structures, facilitating the transmission and manipulation of quantum states and advancing quantum information processing and transmission technologies.

Applications of Maskless Lithography System 8

 

Photomask Fabrication 
High-speed (up to 1200 mm²/min) maskless lithography systems are suitable for the small-batch, customized production of photomasks, reducing reliance on external suppliers and shortening design iteration cycles.

Applications of Maskless Lithography System 9

 

 

Technical specification

 

Model DXMLS-Y
Critical dimension 1.5 um
Minimum equal line/space pitch 2.0 um
Lithography efficiency Shot 1: 20 mm²/min
Overlay accuracy (5 mm x 5 mm) 1000 nm
Overlay accuracy (50 mm x 50 mm) 1500 nm
Light source LED:405 nm / 380 nm
Sample size 3 mm X 3 mm (minimum), 50 mm X 50 mm (maximum)
Sample thickness 0-10 mm
GDS、DWG、DXF
Data format GDS、DWG、DXF
Main unit dimensions (L x W x H) 650 mm X 660 mm X 650 mm
Total equipment weight 75 kg
Installation requirements

Power: 1.3 kW; Temperature: 20–30°C; Humidity: 40–60% RH
Power supply: 220 V ±5%, 50 Hz ±1 Hz, 10 A
A table must be provided (length ≥1.5 m, width ≥1 m, height approx. 0.8 m);

The table must have sufficient load-bearing capacity.

 

This desktop maskless lithography system is compact and versatile, making it ideal for laboratory courses in advanced manufacturing fields such as microelectronics and integrated circuits.
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